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US 8,541,808 B2Granted
Semiconductor light-emitting device
AssigneeRohm Co., Ltd.
InventorMasahiko Kobayakawa
Life of this patent
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Abstract
A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
Claims14
A semiconductor device comprising:
- a first lead frame including a bonding region provided with an upper surface and a lower surface;
- a semiconductor element mounted on the upper surface of the bonding region;
- and
- a case covering part of the first lead frame;
- wherein the first lead frame includes thin extensions extending from the bonding region in a width direction of the first lead frame, each of the thin extensions being smaller in thickness than the bonding region, and
- the lower surface of the bonding region is exposed from a bottom surface of the case.
3 more elements
Dependencies are inferred from the claim text.