Light-emitting-device package and a method for producing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJin Ha Kim, Masami Nei, Seok Min Hwang, Chung Bae Jeon
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Abstract
A light emitting device package includes: a substrate with a mounting surface; a light emitting device bonded to the mounting surface of the substrate; a light reflecting resin part containing a high reflective material, filled on the substrate around the light emitting device so as to extend in a space between the light emitting device and the substrate; and a packing resin part hermetically sealed to cover the light emitting device and the light reflection resin part.
Claims32
A light emitting device package comprising:
- a substrate with a mounting surface;
- a light emitting device bonded to the mounting surface of the substrate;
- a light reflecting resin part containing a high reflective material, formed in a space between the light emitting device and the substrate, and extending from a region formed at the space so as to be formed on the substrate around the light emitting device;
- and
- a packing resin part hermetically sealed to cover the light emitting device and the light reflecting resin part.
A light emitting device package comprising:
- a package main body having a cavity;
- first and second lead frames coupled with the package main body such that the first and second lead frames are exposed from a lower surface of the cavity and face each other;
- at least one light emitting device mounted on one surface of the first and second lead frames;
- a wire electrically connecting a lead frame among the first and second lead frames where the light emitting device is not mounted and the light emitting device;
- a light reflecting resin part coated with a thickness smaller than that of the light emitting device between a side surface of the light emitting device and a side wall of the cavity and containing a high reflective material;
- and
- a packing resin part hermetically sealed at an inner side of the cavity to cover the light emitting device.
A method for fabricating a light emitting device package, the method comprising:
- sequentially forming a bonding pad and a metal bump on a substrate;
- flipchip-bonding a light emitting device on the metal bump;
- forming a light reflecting resin part containing a high reflective material, filling a space between the light emitting device and the substrate, and extending to the vicinity of the light emitting device on the substrate,
- forming a packing resin part to cover the light emitting device and the light reflecting resin part;
- and
- dicing the substrate so as to be separated into individual light emitting device packages.
A method for fabricating a light emitting device package, the method comprising:
- preparing a package main body having a cavity;
- coupling first and second lead frames to the package main body such that they are exposed from a lower surface of the cavity and face each other;
- mounting a light emitting device on an upper surface of one of the first and second lead frames through die bonding;
- forming a wire to electrically connect the light emitting device with a lead frame on which the light emitting device is not mounted among the first and second lead frames;
- forming a light reflecting resin part containing a high reflective material with a thickness smaller than that of the light emitting device such that the light reflecting resin part is coated on a side surface of the light emitting device and on a side wall of the cavity;
- and
- forming a packing resin part at an inner side of the cavity to cover the light emitting device.
Dependencies are inferred from the claim text.