Back to results
US 8,541,800 B2Granted
Light emitting device package, backlight unit, display device and lighting device
AssigneeSamsung Electronics Co., Ltd.
InventorsSeong Ah Joo, Hyo Jin Lee, Il Woo Park, Kyung Tae Kim
Life of this patent
Estimating the term…
Abstract
There is provided a light emitting device package including: a package body providing a chip mounting area and including first and second lead terminals; an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals; a groove portion disposed around the LED chip in the chip mounting area; and a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape defined by the groove portion.
Claims28
A light emitting device package comprising:
- a package body providing a chip mounting area and including first and second lead terminals;
- an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals;
- a groove portion disposed around the LED chip in the chip mounting area;
- and
- a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape substantially defined by the groove portion,
- wherein the LED chip is mounted on an upper surface of one of the first and second lead terminals.
3 more elements
Dependencies are inferred from the claim text.