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US 8,541,799 B2Granted
Light-emitting element package and fabrication method thereof
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsMin-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh, Chi-Wei Liao
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Abstract
A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.
Claims7
A fabrication method for a light-emitting element package, the method comprising:
- providing a plurality of light-emitting elements to mount on a substrate;
- providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold, the upper mold being disposed above the plurality of light-emitting elements, and the bottom mold being disposed below the substrate and attaching the substrate;
- forming a plurality of photonic crystal patterns on the upper mold and the bottom mold, each photonic crystal pattern consisting of a plurality of photonic crystals;
- filling package materials into the high precision wafer level mold module to obtain package members with photonic crystal patterns;
- removing the high precision level mold module to obtain a semi-finished product;
- and
- dicing the semi-finished product to obtain a plurality of light-emitting element packages each including one of the light-emitting elements.
4 more elements
Dependencies are inferred from the claim text.