Packaged semiconductor device having improved locking properties
AssigneeNXP B.V.
InventorsRene Wilhelmus Johannes Maria van den Boomen, Jan van Kempen
Life of this patent
Estimating the term…
Abstract
The invention relates to semiconductor devices and methods of manufacturing. In certain embodiments, a semiconductor device can include: a) a contact pad with pre-shaped sidewalls; b) a semiconductor chip having a terminal that is electrically connected to the contact pad, and c) a protective compound covering the semiconductor chip and at least part of the sidewalls. The sidewall can be rough or the sidewall can be tapered to facilitate locking of the contact pad into the compound.
Claims19
A method of manufacturing a semiconductor device including a semiconductor chip, the method comprising:
- providing a substrate having a first side and a second side opposite to the first side;
- providing a photoresist layer on the first side of the substrate, the photoresist layer including an opening extending to the substrate and having pre-shaped sidewalls;
- filling the opening with an electrically conductive material for defining a contact pad to be formed for being connected to a terminal of a semiconductor chip, wherein the contact pad has further sidewalls that correspond to the pre-shaped sidewalls of the photoresist layer, wherein the sidewalls of the photoresist layer are pre-shaped such that the further sidewalls contained within the opening are formed with a protrusion in a direction having a component orthogonal to the respective sidewall;
- removing the photoresist layer;
- providing the semiconductor chip and mounting said semiconductor chip on the first side of the substrate such that one terminal is electrically connected to the contact pad;
- and
- providing a protective compound covering the substrate and the semiconductor chip and at least the protrusion of at least one of the further sidewalls of the contact pad, the further sidewalls and the protective compound being configured and arranged to secure the semiconductor chip to the contact pad.
A semiconductor device comprising:
- a contact pad including electrically conductive material having a first side and a second side, the contact pad having at least one tapered sidewall such that a width of the contact pad increases towards the first side;
- a semiconductor chip being provided at the first side of the contact pad, the semiconductor chip having a terminal that is electrically connected to the contact pad;
- and
- a protective compound covering the semiconductor chip and at least part of the at least one tapered sidewall, the protective compound and the at least one tapered sidewall being configured and arranged to secure the semiconductor chip to the contact pad.
A semiconductor device comprising:
- a contact pad including electrically conductive material and having a first side and a second side, the contact pad having at least one roughened sidewall;
- a semiconductor chip being provided at the first side of the contact pad, the semiconductor chip having a terminal that is electrically connected to the contact pad;
- and
- a protective compound covering the semiconductor chip and at least part of the at least one roughened sidewall, the protective compound and the at least one roughened sidewall being configured and arranged to secure the semiconductor chip to the contact pad.
Dependencies are inferred from the claim text.