Nitride semiconductor stacked structure and method for manufacturing same and nitride semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorHideto Sugawara
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AssigneeKabushiki Kaisha Toshiba
InventorHideto Sugawara
Estimating the term…
According to one embodiment, a nitride semiconductor stacked structure having a first surface includes a substrate, a first buffer layer, a first crystal layer, a second buffer layer and a second crystal layer. A step portion is provided in the substrate and includes an upper surface, a lower surface, and a side surface between the upper surface and the lower surface. The first buffer layer includes InsAltGa1-s-tN (0≦s≦0.05, 0≦t≦1) and covers the lower surface and the side surface. The first crystal layer is provided on the first buffer layer, includes InsAltGa1-s-tN (0≦s≦0.05, 0≦t≦0.05), and has an upper surface provided above the upper surface of the substrate. The second buffer layer includes InsAltGa1-s-tN (0≦s≦0.05, 0≦t≦1) and continuously covers the upper surface of the first crystal layer and the upper surface of the substrate. The second crystal layer covers the second buffer layer, includes InsAltGa1-s-tN (0≦s≦0.05, 0≦t≦0.05), and has the first surface.
A nitride semiconductor stacked structure having a first surface on which a semiconductor including InxAlyGa1-x-yN (0≦x≦1, 0≦y≦1, x+y≦1) can be stacked, the structure comprising:
A nitride semiconductor stacked structure having a first surface on which a semiconductor including InxAlyGa1-x-yN (0≦x≦1, 0≦y≦1, x+y≦1) can be stacked, the structure comprising:
A nitride semiconductor device comprising:
Dependencies are inferred from the claim text.