Wiring board and method for manufacturing the same

A wiring board, comprising:

• a core substrate having a first surface and a second surface on an opposite side of the first surface;
• a first laminated structure formed on the first surface of the core substrate and comprising a plurality of conductive layers and a plurality of insulation layers;
• and
• a second laminated structure formed on the second surface of the core substrate and comprising a plurality of conductive layers and a plurality of insulation layers,
• wherein the core substrate has a hole and a connection conductor comprising a plating filling the hole, the plurality of insulation layers of the first laminated structure has a plurality of holes and a plurality of connection conductors, the connection conductors of the first laminated structure are stacked one over another and comprise platings filling the holes in the first laminated structure, respectively, the plurality of insulation layers of the second laminated structure has a plurality of holes and a plurality of connection conductors, the connection conductors of the second laminated structure are stacked one over another and comprise platings filling the holes in the second laminated structure, respectively, the connection conductors of the first and second laminated structures are stacked on the connection conductor of the core substrate, the plurality of connection conductors of the first laminated structure includes an outer-layer connection conductor formed in an outer insulation layer of the insulation layers of the first laminated structure, the plurality of connection conductors of the second laminated structure includes an outer-layer connection conductor formed in an outer insulation layer of the insulation layers of the second laminated structure, and the outer-layer connection conductors of the first and second laminated structures have positions which are shifted in a substantially same direction from a position of the connection conductor of the core substrate.