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US 8,541,691 B2Granted
Heat resistant substrate incorporated circuit wiring board
AssigneeIbiden Co., Ltd.
InventorsTakashi Kariya, Toshiki Furutani, Takeshi Kawanishi
Life of this patent
Estimating the term…
Abstract
A circuit wiring board including a wiring substrate, multiple electronic components provided on a surface of the wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a core substrate and a built-up wiring layer formed over the core substrate. The built-up wiring layer includes a conductive layer and an interlayer resin insulating layer, and the electronic components are electrically connected to the conductive layer of the built-up wiring layer.
Claims30
A circuit wiring board comprising:
- a wiring board structure;
- and
- a heat resistant substrate accommodated in an accommodating portion of the wiring board structure and comprising a core substrate, a built-up wiring layer formed over a first surface of the core substrate, and a second built-up wiring layer formed over a second surface of the core substrate on an opposite side of the first surface,
- wherein the core substrate and built-up wiring layer of the heat resistant substrate are positioned in the accommodating portion of the wiring board structure, the built-up wiring layer comprises a conductive layer and an interlayer resin insulating layer, the
- core substrate has a plurality of through hole conductors formed at a pitch and penetrating from the first surface of the core substrate to the second surface of the core substrate, the heat resistant substrate comprises a plurality of connecting pads formed on the second build-up wiring layer, the connecting pads are electrically connected to the plurality of through hole conductors, and the connecting pads are positioned at a pitch which is larger than the pitch of the through hole conductors of the core substrate.
2 more elements
A circuit wiring board comprising:
- a wiring board structure;
- and
- a heat resistant substrate accommodated in an accommodating portion of the wiring board structure and comprising a core substrate, a first face built-up wiring layer formed on a first surface of the core substrate and a second face built-up wiring layer formed on a second surface of the core substrate on an opposite side of the first surface,
- wherein the core substrate and first and second face built-up wiring layers of the heat resistant substrate are positioned in the accommodating portion of the wiring board structure, each of the first and second face built-up wiring layers comprises a conductive layer and an interlayer resin insulating layer, the heat resistant substrate comprises a plurality of connecting pads formed on a surface of the second face built-up wiring layer and a plurality of loading pads formed on a surface of the first face built-up wiring layer such that the loading pads are positioned to be connected to a plurality of electrodes of an electronic component, the core substrate has a plurality of through hole conductors penetrating through the core substrate, the plurality of loading pads and connecting pads are electrically connected to the plurality of through hole conductors, and a pitch of the loading pads, a pitch of the through hole conductors, and a pitch of the connecting pads are increased in an order of the loading pads, the through hole conductors and the connecting pads.
1 more element
Dependencies are inferred from the claim text.