Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component

A process for producing an intermediate layer for disentangling contact or connection sites of an electronic component from contact or connection surfaces of a circuit board, comprising the steps of:

• providing the circuit board with a plurality of contact or connection surfaces;
• forming a base material of the intermediate layer merely in the region of the contact or connection surfaces of the circuit board;
• structuring the intermediate layer to form conductive tracks or structures and contact sites for contacting with contact or connection surfaces of the circuit board and with contact or connection sites of an electronic component to be attached on the circuit board;
• wherein, after the structuring of the intermediate layer, an additional support layer for the attachment or contacting of the electronic component is applied on the intermediate layer for disentanglement and provided with contacts for the electronic component;
• wherein the additional support layer covers both the intermediate layer and portions of the circuit board;
• and
• wherein the intermediate layer is created as a part of a substrate of the circuit board by adding a layer to the circuit board.

A system including a circuit board and at least one electronic component, wherein at least one intermediate layer for the disentanglement of contact or connection sites of the electronic component from contact or connection surfaces of the circuit board is formed between the contact or connection sites of the electronic component and the contact or connection surfaces of the circuit board, and that the contact or connection sites of the electronic component comprise mutual distances reduced relative to the contact or connection sites of the circuit board;

• wherein an additional support layer for the attachment and contacting of the electronic component is applied on the intermediate layer for disentanglement and provided with contacts for the electronic component;
• wherein the intermediate layer is merely formed in the region of the contact or connection surfaces of the circuit board as well as the contact or connection sites of the electronic component;
• wherein the additional support layer covers both the intermediate layer and portions of the circuit board;
• and wherein the intermediate layer is created as part of a substrate of the circuit board by adding a layer to the circuit board.