Circuit connection material, circuit member connecting structure and method of connecting circuit member
AssigneeHitachi Chemical Company, Ltd.
InventorsMotohiro Arifuku, Nichiomi Mochizuki, Takashi Nakazawa, Kouji Kobayashi, Tohru Fujinawa, Takashi Tatsuzawa
Life of this patent
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Abstract
The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
Claims17
A circuit-connecting material for connection between circuit members, wherein each circuit member has a board and a circuit electrode formed on a primary surface of said board, the material comprising:
- (a) an adhesive composition that cures in response to light or heat;
- and
- (b) an organic compound comprising a urethane group and an ester group, wherein the organic compound has a weight-average molecular weight of 5,000 to 100,000.
A circuit member connection structure comprising:
- (a) a first circuit member comprising a first board and a first circuit electrode formed on a primary surface of the first board;
- and
- (b) a second circuit member comprising a second board and a second circuit electrode formed on a primary surface of the second board, wherein the first circuit member and the second circuit member are connected by a circuit-connecting member made of a cured product of a circuit-connecting material formed between the first circuit member and the second circuit member so that the first circuit electrode and the second circuit electrode are opposing each other and are electrically connected, wherein the circuit-connecting material comprises
- i. an adhesive composition that cures in response to light or heat;
- and
- ii. an organic compound comprising a urethane group and an ester group,
- wherein the organic compound has a weight-average molecular weight of 5,000 to 100,000.
Dependencies are inferred from the claim text.