Wiring member and method for producing the same
AssigneeShin-Etsu Polymer Co., Ltd.
InventorsToshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Mitsuaki Negishi
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Abstract
A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.
Claims12
A wiring member comprising:
- a copper foil;
- a noise suppressing layer comprising a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm;
- an organic polymer film provided between the copper foil and the noise suppressing layer;
- and
- an insulating adhesive layer provided between the copper foil and the organic polymer film.
A wiring member comprising:
- a copper foil;
- an organic polymer film;
- a noise suppressing layer provided between the copper foil and the organic polymer film, the noise suppressing layer including a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm;
- and
- an insulating adhesive layer provided between the copper foil and the noise suppressing layer.
Dependencies are inferred from the claim text.