Reduction of pore fill material dewetting

A method comprising:

• providing a structure comprising a first layer overlying a substrate, where the first layer comprises a dielectric material having a plurality of pores;
• applying a filling material to a surface of the first layer, where the filling material comprises a polymer and at least one additive, where the at least one additive comprises at least one of a surfactant, a high molecular weight polymer and a solvent having a boiling temperature greater than 150° C., where the at least one additive is operable to raise a dewet start temperature of the filling material, where the dewet start temperature is a temperature at which the surface of the first layer begins to dewet, where the at least one additive is thermally removable, where the high molecular weight polymer has a molecular weight about or greater than 2000 g/mol, where the at least one additive is selected based on one or more of:
• a thickness of the first layer, the dielectric material, the filling material, a temperature used to heat the structure and enable the filling material to at least partially fill the plurality of pores, a heating time, and pore size of the plurality of pores;
• and
• applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on surface of the first layer.