Method for manufacturing light emitting device package and frame for manufacturing light emitting device package
AssigneeSamsung Electronics Co., Ltd.
InventorChoong Hwan Kwon
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AssigneeSamsung Electronics Co., Ltd.
InventorChoong Hwan Kwon
Estimating the term…
A method for manufacturing a light emitting device package includes: preparing a base frame including an annular base part, at least a pair of lead parts extending to an inner side of the base part, and at least one support part extending to the inner side of the base part in a direction different from that of the lead parts and having a step structure formed on at least one surface of an end thereof; forming a package main body such that the package main body is combined to the step structure of the support part; separating the lead parts from the base part; disposing a light emitting device on at least one of the lead parts; and separating the package main body from the support part.
A method for manufacturing a light emitting device package, the method comprising:
Dependencies are inferred from the claim text.