Resin film forming method
AssigneeFujitsu Limited
InventorTomomi Sato
Life of this patent
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Abstract
A resin film forming method for forming a resin film on a substrate includes forming an intermediate layer on the substrate which includes an inorganic composition as a main component to chemically bond the resin film to be formed on the substrate to the substrate, carrying out a treatment on the substrate to remove an edge of the intermediate layer from an edge of the substrate, forming the resin film on the substrate by spin coating, chemically bonding the resin film to the substrate and hardening the resin film, and removing an edge of the resin film from the edge of the substrate by applying vibrations to the hardened resin film.
Claims7
A resin film forming method for forming a resin film over a substrate, the method comprising:
- forming an intermediate layer on the substrate which includes an inorganic composition as a main component to chemically bond the resin film to be formed over the substrate to the substrate;
- covering the intermediate layer with a mask in a region which does not include an edge of the intermediate layer and carrying out an ashing process on the edge of the intermediate layer;
- forming the resin film over the substrate by spin coating;
- chemically bonding the resin film to the substrate and hardening the resin film;
- and
- removing an edge of the resin film from the edge of the substrate by applying vibrations to the hardened resin film.
A pattern forming method for forming a pattern over a substrate, the method comprising:
- forming an intermediate layer on the substrate which includes an inorganic composition as a main component to chemically bond a resin film to be formed over the substrate to the substrate;
- covering the intermediate layer with a mask in a region which does not include an edge of the intermediate layer and carrying out an ashing process on the edge of the intermediate layer;
- forming the resin film over the substrate by spin coating;
- chemically bonding the resin film to the substrate and hardening the resin film;
- removing an edge of the resin film from the edge of the substrate by applying vibrations to the hardened resin film;
- and
- forming a pattern on the resin film by pressing the resin film on a mold and transferring a mold pattern thereto.
A pattern forming method of forming a pattern over a substrate, the method comprising:
- forming an intermediate layer on the substrate which includes an inorganic composition as a main component to chemically bond a resin film to be formed over the substrate to the substrate;
- covering the intermediate layer with a mask in a region which does not include an edge of the intermediate layer and carrying out an ashing process on the edge of the intermediate layer;
- forming the resin film over the substrate by spin coating;
- chemically bonding the resin film to the substrate and hardening the resin film;
- removing an edge of the resin film from the edge of the substrate by applying vibrations to the hardened resin film;
- and
- forming a pattern on the resin film by adhering an exposure mask to the resin film and exposing the resin film.
Dependencies are inferred from the claim text.