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US 8,541,160 B2Granted
Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the same
AssigneeFUJIFILM Corporation
InventorAkinori Shibuya
Life of this patent
Estimating the term…
Abstract
Provided is an actinic-ray- or radiation-sensitive resin composition excelling in the LWR, pattern collapse performance and DOF, and a method of forming a pattern using the same. The composition according to the present invention contains (A) a resin containing a repeating unit with any of partial structures of general formula (I) below, (B) a compound (PA) as defined in the specification, and (C) a compound being configured to generate an acid when exposed to actinic rays or radiation, wherein the resin is contained in an amount of 50 mass % or more based on total solids of the composition.
Claims23
An actinic-ray- or radiation-sensitive resin composition comprising:
- (A) a resin containing a repeating unit with any of partial structures of general formula (I) below, the resin being configured to increase its rate of dissolution in an alkali developer when acted on by an acid;
- (B) a compound (PA) containing a functional group with proton acceptor properties and being configured to decompose when exposed to actinic rays or radiation to thereby produce a compound exhibiting lower or no proton acceptor properties or a compound exhibiting acid properties instead of the proton acceptor properties;
- and
- (C) a compound being configured to generate an acid when exposed to actinic rays or radiation;
- wherein the resin is contained in an amount of 50 mass % or more based on total solids of the composition,
- in which R13 represents a hydrogen atom, an alkyl group or a cycloalkyl group;
- and
- wherein the composition further comprises a hydrophobic resin.
5 more elements
An actinic-ray- or radiation-sensitive resin composition comprising:
- (A) a resin containing a repeating unit with any of partial structures of general formula (I) below, the resin being configured to increase its rate of dissolution in an alkali developer when acted on by an acid;
- (B) a compound (PA) containing a functional group with proton acceptor properties and being configured to decompose when exposed to actinic rays or radiation to thereby produce a compound exhibiting lower or no proton acceptor properties or a compound exhibiting acid properties instead of the proton acceptor properties;
- and
- (C) a compound being configured to generate an acid when exposed to actinic rays or radiation;
- wherein the resin is contained in an amount of 50 mass % or more based on total solids of the composition,
- in which R13 represents a hydrogen atom, an alkyl group or a cycloalkyl group and
- wherein the acid generator (C) is limited to a compound represented by general formula (ZI) or (ZII)
- wherein in general formula (ZI),
- each of R201, R202 and R203 independently represents an organic group, and
- Z− represents an sulfonate anion configured to generate the acid represented by general formula (I) below:
- wherein in general formula (ZII),
- each of R204 and R205 independently represents an aryl group, an alkyl group or a cycloalkyl group, and
- Z− represents an sulfonate anion configured to generate the acid represented by general formula (I) below:
- wherein in general formula (I),
- each of Xfs independently represents a fluorine atom or an alkyl group having at least one hydrogen atom thereof substituted with one or more fluorine atoms,
- each of R1 and R2 represents a hydrogen atom,
- L, when z≧2 each independently, represents a bivalent connecting group,
- A represents an organic group with a cyclic structure,
- x is 1 or 2,
- y is an integer of 0 to 10, and
- z is an integer of 0 to 10.
18 more elements
An actinic-ray- or radiation-sensitive resin composition comprising:
- (A) a resin containing a repeating unit with any of partial structures of general formula (I) below, the resin being configured to increase its rate of dissolution in an alkali developer when acted on by an acid;
- (B) a compound (PA) containing a functional group with proton acceptor properties and being configured to decompose when exposed to actinic rays or radiation to thereby produce a compound exhibiting lower or no proton acceptor properties or a compound exhibiting acid properties instead of the proton acceptor properties;
- and
- (C) a compound being configured to generate an acid when exposed to actinic rays or radiation;
- wherein the resin is contained in an amount of 50 mass % or more based on total solids of the composition,
- in which R13 represents a hydrogen atom, an alkyl group or a cycloalkyl group, and
- wherein the resin (A) further contains at least two kinds of repeating unit represented by general formula (1) below:
- wherein in general formula (I),
- R1 represents a hydrogen atom, a methyl group or any of the groups of the formula —CH2—R9, in which R9 represents a monovalent organic group,
- R2 represents an alkyl group or a cycloalkyl group and
- R represents an atomic group required for forming an alicyclic structure in cooperation with a carbon atom.
8 more elements
Dependencies are inferred from the claim text.