Heat-resistant resin
AssigneeNitto Denko Corporation
InventorsHirofumi Fujii, Yoshio Terada, Kazumasa Igarashi
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Abstract
The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.
Claims8
A dust removal member comprising a silicon wafer and a thermoplastic resin formed on the silicon wafer, wherein the thermoplastic resin has a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher.
Dependencies are inferred from the claim text.