Manufacturing method of housing of electronic device
AssigneeQuanta Computer Inc.
InventorShu-Chen Lin
Life of this patent
Estimating the term…
Abstract
A manufacturing method of housing of electronic device comprises following steps: providing a metal member; forming a plurality of micro anchored apertures on a surface of the metal member; placing the metal member in a plastic injection mold, wherein the plastic injection mold is set at a first temperature; and providing a molten plastic material in the plastic injection mold for integrating with the surface of the metal member with an injection molding manner, wherein the plastic injection mold is set at a second temperature, and the second temperature is higher than the first temperature.
Claims10
A manufacturing method of a housing of an electronic device, comprising:
- providing a metal member;
- forming a plurality of nano-class apertures on a surface of the metal member;
- enlarging each of the nano-class apertures and roughening inner walls of the nano-class apertures so that the nano-class apertures become micro-class anchored apertures, wherein inner walls of the micro-class anchored apertures are formed with uneven cavities and protrusions thereon;
- placing the metal member in a plastic injection mold, wherein the plastic injection mold is set at a first temperature;
- and
- providing a molten plastic material in the plastic injection mold for being combined with the surface of the metal member having the micro-class anchored apertures, wherein the plastic material fills in the micro-class anchored apertures and fully abuts and adheres on the inner walls of the micro-class anchored apertures, and the plastic injection mold is set at a second temperature, and the second temperature is higher than the first temperature.
Dependencies are inferred from the claim text.