Electrically conductive paste, and electrical and electronic device comprising the same

An electrically conductive paste comprising:

• from 75 to 85% by weight of an electrically conductive filler ingredient comprising alloy particles A made of a combination of Sn and one or more elements selected from the group consisting of Bi, In, Ag and Cu, and alloy particles B made of a combination of Sn and one or more elements selected from the group consisting of Bi, In, Ag and Cu;
• a thermosetting resin ingredient;
• a hardening agent ingredient;
• a flux ingredient;
• and a viscosity adjusting/thixotropy imparting additive,
• wherein a content of the alloy particles B is 3 to 20% by weight based on 100% by weight of the electrically conductive filler ingredient;
• a melting point of the alloy particles B is at least 10° C. and at most 50° C. lower than a melting point of the alloy particles A;
• and
• the melting point of the alloy particles A is in a range from 95 to 220° C. and is lower than a hardening temperature of the thermosetting resin ingredient.