Plating method and apparatus with multiple internally irrigated chambers

An apparatus for electroplating a layer of metal onto a work piece surface, the apparatus comprising:

• (a) a chamber;
• (b) a membrane separating the chamber into an anolyte chamber and a catholyte chamber;
• and
• (c) a catholyte manifold for delivering catholyte to the catholyte chamber, the catholyte manifold comprising a catholyte delivery structure having a plurality of outlet ports and located wholly within the catholyte chamber;
• (d) a wafer holder for maintaining the work piece surface in the catholyte chamber during electroplating;
• and
• (e) a high resistance virtual anode comprising a plurality of parallel holes and positioned in the catholyte chamber to be (i) proximate and parallel to the work piece during electroplating and (ii) above the catholyte manifold delivery structure.

A method of electroplating a layer of metal onto a work piece surface, comprising:

• (a) holding a work piece in a work piece holder of an electroplating apparatus, wherein the apparatus includes a membrane separating the chamber into an anolyte chamber and a catholyte chamber;
• (b) flowing catholyte through a catholyte manifold and a catholyte delivery structure having a plurality of outlet ports and located wholly within the catholyte chamber, wherein catholyte delivery structure delivers impinging catholyte onto the membrane;
• and
• (c) supplying current to the work piece to plate a metal layer onto a work piece surface.