Apparatus and method for plating substrate

An apparatus for plating a substrate, comprising:

• a substrate support member;
• a plating solution supply member disposed above the substrate support member, the plating solution supply member discharging a plating solution onto a plating surface of the substrate, the plating solution supply member includes:
• an enclosure having an inner space with opened lower portion and a fluid inlet;
• a positive electrode disposed in the inner space, the positive electrode providing positive ions into the plating solution;
• and
• an ion exchange membrane disposed below the positive electrode and above the opened lower portion, the ion exchange membrane being permeable only to the positive ions;
• a plating bath configured to receive the plating solution and immerse the substrate support member thereof;
• and
• a bowl configured to completely surround the plating bath and recover the plating solution overflowing from the plating bath,
• wherein the substrate support member includes a support plate to support the substrate and allow the plating solution to be applied onto the plating surface of the substrate.