Connecting structure and production method

A connecting structure to connect electronic components electrically, the connecting structure comprising:

• a plurality of conducting lines, each of the conducting lines including a covered segment including a wire conductor covered with an insulating covering and an uncovered segment including the wire conductor in an uncovered state having no insulating covering;
• a molding member of a resin material enclosing a boundary portion between the covered segment and the uncovered segment of each of the conducting lines so that the uncovered segments project in a first direction from a first end of the molding member and the covered segments project in a second direction from a second end of the molding member, and thereby holding the conducting lines to fix positions relative to one another;
• a holding member including a base portion fitting over the molding member liquid-tightly, and a wall portion projecting from the base portion in the second direction beyond the second end of the molding member and surrounding the covered segments of the conducting lines projecting from the second end of the molding member;
• and
• an adhesive provided in the holding member, the adhesive adhering to each of the covered segments of the conducting lines projecting from the second end of the molding member,
• wherein the base portion of the holding member comprises:
• an engagement hole in which the molding member is fitted,
• an abutment surface facing in the first direction around the molding member,
• an inner end surface facing in the second direction around the molding member, and defining a bottom of a depression surrounded by the wall portion and depressed in the first direction to retain the adhesive;
• and
• wherein the first end the molding member projects in the first direction from the abutment surface of the holding member, and the second end of the molding member projects in the second direction from the inner end surface of the base portion.