Semiconductor molding chamber
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu
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Abstract
A system and method for a semiconductor molding chamber is disclosed. An embodiment comprises a top molding portion and a bottom molding portion that form a cavity between them into which a semiconductor wafer is placed. The semiconductor molding chamber has a first set of vacuum tubes which hold and fix the position of the semiconductor wafer and a second set of vacuum tubes which evacuate the cavity of extraneous ambient gasses. The encapsulant may then be placed over the semiconductor wafer in order to encapsulate the semiconductor wafer.
Claims20
A system for encapsulating a semiconductor device comprising:
- a molding chamber comprising a first variable pressure region, a second variable pressure region, and a semiconductor wafer receiving region located between the first variable pressure region and the second variable pressure region;
- a gas-impermeable material isolating the first variable pressure region from the second variable pressure region where the first variable pressure region is not separated from the second variable pressure region by the semiconductor receiving region;
- at least one first vacuum hole extending through the molding chamber, the at least one first vacuum hole opening to the first variable pressure region;
- and
- at least one second vacuum hole extending through the molding chamber and located opposite the semiconductor wafer receiving region from the second variable pressure region and operably connected to the second variable pressure region.
A system for encapsulating a semiconductor device comprising:
- a mold defined by a top molding portion and a bottom molding portion;
- a first vacuum separator and a second vacuum separator located on one of the bottom molding portion and the top molding portion;
- a first vacuum hole extending through the mold and operably connected to control a first pressure in a first pressure zone, the first pressure zone enclosed by the first vacuum separator;
- and
- a second vacuum hole extending through the mold and operably connected to control a second pressure in a second pressure zone separately from the first pressure in the first pressure zone, the second pressure zone being connected to the second vacuum hole through openings in the second vacuum separator.
A system for encapsulating a semiconductor device comprising:
- an upper molding portion and a lower molding portion;
- a molding chamber located between the upper molding portion and the lower molding portion, the molding chamber comprising:
- a first pressure region adjacent to the lower molding portion;
- and
- a second pressure region adjacent to the lower molding portion, wherein the second pressure region is isolated from the first pressure region next to the lower molding portion by a first vacuum separator located on the lower molding portion.
Dependencies are inferred from the claim text.