Image capture lens, wafer lens, wafer lens laminate, method of manufacturing image capture lens, image capture lens intermediate product, method of manufacturing image capture lens intermediate product

An image capture lens, comprising;

• a diaphragm formed on a substrate and having a predetermined aperture for adjusting quantity of light;
• an inorganic or organic adhesive layer formed on the substrate so as to expose the diaphragm;
• and
• a resin component having a lens portion made of a curable resin, wherein the resin component is bonded directly to the inorganic or organic adhesive layer, and to the diaphragm.

A wafer lens, comprising:

• a plurality of diaphragms formed on a substrate, each having a predetermined aperture for adjusting quantity of light;
• an inorganic or organic adhesive layer formed on the substrate so as to cover the diaphragms;
• and
• a resin component having a plurality of lens portions made of a curable resin, wherein the resin component is bonded directly to the inorganic or organic adhesive layer, and
• the diaphragm are composed of a resin which contains a black filler.

A wafer lens, comprising;

• a plurality of diaphragms formed on a substrate, each having a predetermined aperture for adjusting quantity of light;
• an inorganic or organic adhesive layer formed on the substrate so as to expose the diaphragms;
• and
• a resin component having a plurality of lens portions made of a curable resin, wherein the resin component is bonded directly to the inorganic or organic adhesive layer, and to the diaphragms.

A wafer lens, comprising:

• a plurality of diaphragms formed on a substrate, each having a predetermined aperture for adjusting quantity of light;
• an inorganic or organic adhesive layer formed on the substrate so as to expose the diaphragms;
• and
• a resin component having a plurality of lens portions made of a curable resin, wherein
• the resin component is bonded directly to the inorganic or organic adhesive layer, and to the diaphragms, and
• a spacer having opening at positions corresponded to the plurality of lenses in the direction of optical axis thereof, is bonded to positions in a direction of optical axis corresponding to the plurality of lens portions.

A wafer lens laminate configured by stacking a plurality of wafer lenses, wherein

• at least one wafer lens out of the plurality of wafer lenses comprises:
• a plurality of diaphragms formed on a substrate, each having a predetermined aperture for adjusting quantity of light;
• an inorganic or organic adhesive layer formed on the substrate so as to expose the diaphragms;
• and
• a resin component having a plurality of lens portions made of a curable resin, the resin component being bonded directly to the inorganic or organic adhesive layer, and to the diaphragms.

A method of manufacturing an image capture lens which has a resin component including a lens portion made of a curable resin, which resin component being formed on a substrate, the method comprising:

• a diaphragm forming process for forming on the substrate, each of a plurality of diaphragms having a predetermined aperture for adjusting quantity of light;
• an adhesive layer forming process following after the diaphragm forming process, for forming on the substrate having the diaphragms formed thereon, an inorganic or organic adhesive layer so as to cover the diaphragms;
• a molding process following after the adhesive layer forming process, for forming the resin component by dropping the curable resin between the inorganic or organic adhesive layer and a molding die having a molding surface for forming a plurality of the lens portions, and by molding and curing the resin under pressurized die;
• a dicing process following after the molding process, for dicing a work to singulate the plurality of the lens portions into a single lens portion;
• and
• a surface modification process for performing a surface modification treatment so as to adjust wettability of the surface of the substrate and the surface of the diaphragms after the diaphragm forming process, in the range from 3° or larger and 30° or smaller in terms of water contact angle.

A method of manufacturing an image capture lens having a resin component which has a lens portion made of a curable resin, which resin component being formed on a substrate, the method comprising:

• a diaphragm forming process for forming on the substrate, each a plurality of diaphragms having a predetermined aperture for adjusting quantity of light;
• an adhesive layer forming process following after the diaphragm forming process, for forming on the substrate having the diaphragms formed thereon, an inorganic or organic adhesive layer so as to cover the diaphragms;
• an adhesive layer removing process following after the adhesive layer forming process, for removing portions of the inorganic or organic adhesive layer formed on the diaphragms;
• a molding process following after the adhesive layer removing process, for forming the resin component by dropping the curable resin between the inorganic or organic adhesive layer and a molding die having a molding surface for forming a plurality of the lens portions, and by molding and curing the resin under pressurized die;
• and
• a dicing process following after the molding process, for dicing a work to thereby singulate the plurality of the lens portions into a single lens portion.

A method of manufacturing an image capture lens having a resin component which has a lens portion made of a curable resin and which resin component being formed on at least one surface of a substrate, the method comprising:

• a diaphragm forming process for forming on at least one surface of the substrate, a plurality of diaphragms each having a predetermined aperture for adjusting quantity of light;
• an adhesive layer forming process following after the diaphragm forming process, for forming on the substrate having the diaphragms formed thereon, an inorganic or organic adhesive layer so as to cover the diaphragms;
• an adhesive layer removing process following after the adhesive layer forming process, for removing portions of the inorganic or organic adhesive layer formed on the diaphragms;
• a molding process following after the adhesive layer removing process, for forming the resin component by dropping the curable resin between the inorganic or organic adhesive layer and a molding die having a molding surface for forming a plurality of the lens portions, and by molding and curing the resin under pressurized die;
• a stacking process for forming a wafer lens laminate by stacking a plurality of the wafer lenses obtained by the molding process;
• and
• a dicing process following after the stacking process, for dicing a work to singulate the plurality of the lens portions into a single lens portion.