Methods for stud bump formation and apparatus for performing the same

A method comprising:

• securing a wire relative to a capillary using a clamp, the clamp comprising at least two opposing plates, at least one of the opposing plates comprising a notcher contacting the wire when the wire is secured to form a first notch in the wire;
• while the wire is secured using the clamp, bonding the secured wire to a bonding surface to form a bonded wire;
• allowing a notch pitch distance of the bonded wire to pass through the clamp;
• and
• securing the bonded wire using the clamp, the notcher contacting the bonded wire to form a second notch in the bonded wire, the second notch being the notch pitch distance from the first notch along the bonded wire.

A bonder comprising:

• a clamp comprising:
• a first component comprising a first plate with a first surface;
• and
• a second component comprising a second plate with a second surface, the second surface opposing the first surface, at least one of the first surface and the second surface comprising a protruding notcher, the second component being coupled to the first component, the second component capable of articulating about a pivot on the first component to move the second surface closer to the first surface or to move the second surface further from the first surface, the first surface and the second surface being capable of clamping a wire and forming a notch in the wire using the protruding notcher when the first surface and the second surface are brought together, at least one of the first surface and the second surface comprising a contact stopper;
• and
• a bond head, the clamp being attached to the bond head.