US 8,539,795 B2Granted

Methods for cutting a fragile material

AssigneeCorning Incorporated

InventorsThierry Luc Alain Dannoux, Philippe Lehuede

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Abstract

Methods for cutting a fragile material are provided. The methods comprise the step of heating the fragile material along a separation path to separate the fragile material into a first portion and a second portion. At least the first portion includes a first thermal affected zone extending along the separation path. The methods further include the steps of spontaneously splitting at least part of the first thermal affected zone from the remainder of the first portion along a first split path extending a first distance from the separation path. The spontaneous splitting occurs as a consequence of the step of heating the fragile material.

Claims17

Dependent claims

A method for cutting a fragile material (10) comprising the steps of:

separating the fragile material along a separation path (12) into a first portion (14a) and second portion (14b) by heating the fragile material with a laser (50) along the separation path (12), wherein at least the first portion (14a) is separated from the second portion (14b) with the first portion (14a) including a first thermal affected zone (16a) extending along the separation path;
and then
subsequently splitting at least part of the first thermal affected zone from the remainder of the first portion along a first split path (18a) extending a first distance (L1) laterally spaced from the separation path, wherein the subsequent splitting occurs as a consequence of heating the fragile material during the step of separating.

Dependencies are inferred from the claim text.

Facts

Application: 13/319,200Filed 13 May 2010
Published: US 2012/0047957 A11 Mar 2012
Granted: 24 Sep 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

C03B 33/091
By thermal shock: using at least one focussed radiation beam, e.g. laser beam
B23K 26/40
Removing material: taking account of the properties of the material involved
C03B 33/093
Using at least one focussed radiation beam, e.g. laser beam: using two or more focussed radiation beams
B23K 2103/50
Materials to be soldered, welded or cut: inorganic materials other than metals or composite materials

Family

US 2012/0047957 A1Pre-grant publication · published 1 Mar 2012
US 8,539,795 B2This patent

From the US filing history. Foreign family members aren’t listed.

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