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US 8,526,177 B2Granted
Fan for cooling multiple processors housed in a sub-chassis
AssigneeHewlett-Packard Development Company, L.P.
InventorsDavid M. Paquin, John D. Nguyen, Michael L. Sabotta, Larry E. Wilson
Life of this patent
Estimating the term…
Abstract
A chassis comprises a printed circuit board (PCB) and a sub-chassis housing multiple processors that couple to the PCB. The sub-chassis is disposed above and parallel to the PCB. The multiple processors are cooled by a fan disposed on the sub-chassis.
Claims14
A chassis, comprising:
- a printed circuit board (PCB);
- and a sub-chassis housing multiple processors that couple to the PCB, said sub-chassis is disposed above and parallel to said PCB;
- wherein said multiple processors are cooled by a sub-chassis fan disposed on an extension that connects to an enclosure of said sub-chassis that houses said multiple processors, the enclosure comprising a pair of side members, front and back members, and a top member;
- and wherein the extension is formed outside of the side members, the front and back members, and the top member of the enclosure, and wherein the extension has a first major surface which abuts the bottom of the sub-chassis fan, wherein the first major surface of the extension is in a plane that is substantially parallel to, and faces the top member of, the enclosure.
1 more element
A system chassis, comprising:
- a chassis fan;
- and
- a server node disposed posterior to said chassis fan and capable of being cooled by said chassis fan, the server node comprising:
- a printed circuit board (PCB);
- a sub-chassis, disposed above and parallel to said PCB, comprising an enclosure housing processors that couple to said PCB, the enclosure comprising a pair of side members, front and back members, and a top member;
- and
- sub-chassis fans disposed on an extension that connects to the enclosure of said sub-chassis, anterior to said processors and above said PCB, said sub-chassis fans adapted to cool said processors;
- wherein the extension is horizontally formed outside of the side members, the front and back members, and the to member of the enclosure;
- wherein the sub-chassis fans propel air through an orifice and into said enclosure;
- and
- wherein the chassis comprises a 2U server chassis.
8 more elements
An apparatus, comprising:
- an enclosure that houses multiple processors, the enclosure comprising a pair of side members, front and back members, and a top member;
- means for coupling a printed circuit board (PCB) to said processors;
- a horizontal extension that protrudes outwardly away from said enclosure, wherein the extension is formed outside of the side members, the front and back members, and the to a member;
- and
- means for cooling said multiple processors, the means for cooling mounted on said extension entirely outside of the enclosure and propagating airflow into said enclosure via an orifice;
- wherein the enclosure is disposed superior to said PCB.
3 more elements
Dependencies are inferred from the claim text.