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US 8,525,328 B2Granted
Power device package structure
AssigneeIndustrial Technology Research Institute
InventorsJiin-Shing Perng, Min-Lin Lee, Shinn-Juh Lai, Huey-Ru Chang
Life of this patent
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Abstract
The disclosure relates to a power device package structure. By employing the metal substrate of the power device package structure serve as a bottom electrode of a capacitor, the capacitor is integrated into the power device package structure. A dielectric material layer and a upper metal layer sequentially disposed on the metal substrate.
Claims14
A power device package structure, comprising:
- a metal base plate;
- a dielectric material layer disposed on the metal base plate;
- a resistor disposed on the dielectric material layer;
- at least one power device disposed on the metal base plate, wherein the at least one power device has a gate terminal, a drain terminal and a source terminal;
- and
- an upper metal layer disposed on the dielectric material layer, wherein the upper metal layer, the dielectric material layer and the metal base plate form a capacitor, and the resistor is electrically connected with the upper metal layer and the source terminal of the power device through wires, while the metal base plate is electrically connected to the drain terminal through another wire, wherein the dielectric material layer is located beside but separate from the power device, while the resistor is located beside but separate from the upper metal layer.
3 more elements
A power device package structure, comprising:
- a metal base plate;
- a dielectric material layer disposed on the metal base plate;
- a resistor disposed on the dielectric material layer;
- an upper metal layer disposed on the dielectric material layer;
- and
- at least one power device disposed on the upper metal layer, wherein the at least one power device has a gate terminal, a drain terminal and a source terminal, the upper metal layer, the dielectric material layer and the metal base plate form a capacitor, and the resistor is electrically connected with the upper metal layer and the source terminal of the power device through wires, the metal base plate is electrically connected to the drain terminal through another wire, and wherein the resistor is located beside but separate from the upper metal layer.
3 more elements
Dependencies are inferred from the claim text.