Clamping mechanism automatically adaptable to change of thickness of printed circuit board
AssigneeHiwin Mikrosystem Corp.
InventorsCheng-Feng Lin, Chi-Tai Liu
Life of this patent
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AssigneeHiwin Mikrosystem Corp.
InventorsCheng-Feng Lin, Chi-Tai Liu
Estimating the term…
A clamping mechanism automatically adaptable to change of thickness of printed circuit board includes: a frame body having two parallel rail seats; two clamping rail members respectively mounted on the rail seats for clamping a printed circuit board, each clamping rail member including a first clamping rail and a second clamping rail spaced from each other by a clamping gap; and two adjustment units for adjusting the clamping gap of the clamping rail members. Each the adjustment unit includes: a support section mounted on the frame body to provide a support face; a connection section, one end of the connection section being affixed to the first clamping rail, the other end of the connection section being positioned above the support face; and a floating section positioned between the connection section and the support section and supported on the support face to apply a resilient support force to the connection section.
A clamping mechanism automatically adaptable to change of thickness of printed circuit board, comprising:
A clamping mechanism automatically adaptable to change of thickness of printed circuit board, comprising:
A clamping mechanism automatically adaptable to change of thickness of printed circuit board, comprising:
Dependencies are inferred from the claim text.