Semiconductor device and manufacturing method thereof

A semiconductor device comprising:

• a transistor including a source region and a drain region;
• an insulating layer provided over the transistor;
• a first conductive layer directly connected to one of the source region and the drain region through a first opening portion in the insulating layer;
• a second conductive layer directly connected to the other of the source region and the drain region through a second opening portion in the insulating layer;
• a first resin layer over the insulating layer;
• a layer comprising a conductive particle directly connected to the first conductive layer in a third opening portion of the first resin layer;
• and
• a first substrate with a second resin layer and a third conductive layer,
• wherein the first conductive layer and the second conductive layer are in contact with the first resin layer,
• wherein the third conductive layer is electrically connected to the first conductive layer with the second resin layer and the layer comprising the conductive particle interposed therebetween, and
• wherein the first substrate is provided over the first resin layer with the second resin layer interposed therebetween.

A semiconductor device comprising:

• a transistor including a source region and a drain region;
• an insulating layer over the transistor;
• a first conductive layer directly connected to one of the source region and the drain region through a first opening portion in the insulating layer;
• a second conductive layer directly connected to the other of the source region and the drain region through a second opening portion provided in the insulating layer;
• a first resin layer over the insulating layer;
• a first layer comprising a first conductive particle directly connected to the first conductive layer in a third opening portion of the first resin layer;
• and
• a first substrate with a second resin layer, a third conductive layer, and a second layer comprising a second conductive particle,
• wherein the first conductive layer and the second conductive layer are in contact with the first resin layer,
• wherein the third conductive layer is electrically connected to the first conductive layer with the second layer comprising the second conductive particle, the second resin layer, and the first layer comprising the first conductive particle interposed therebetween, and
• wherein the first substrate is provided over the first resin layer with the second resin layer interposed therebetween.