Substrate processing method and film forming method

A film forming method for forming a film on a substrate in a processing chamber comprising:

• accommodating a substrate into a processing chamber;
• and
• introducing a process gas into the processing chamber and forming a film on the substrate on the basis of
• a correlation of a preset temperature of a heating device,
• a flow rate of fluid supplied by a cooling device, and
• a temperature deviation between a center portion of the substrate accommodated in the processing chamber and an outer peripheral side of the substrate,
• wherein temperature is measured using an L-type temperature sensor.

A non-transitory computer-readable medium storing a control program which, when executed by a hardware processor, causes a computer to function as a device comprising:

• means for accommodating a substrate into a processing chamber;
• and
• means for processing the substrate in the processing chamber on the basis of
• a correlation of a preset temperature of a heating device,
• a flow rate of fluid supplied by a cooling device, and
• a temperature deviation between a center portion of the substrate accommodated in the processing chamber and an outer peripheral side of the substrate,
• wherein temperature is measured using an L-type temperature sensor.