Polymer removing apparatus and method
AssigneeTokyo Electron Limited
InventorsTakehiro Shindou, Masaki Kondo
Life of this patent
Estimating the term…
Abstract
A polymer removing apparatus for use in removing polymer annularly adhered to a peripheral portion of a target substrate includes a processing chamber for accommodating the target substrate having the polymer annularly adhered to the peripheral portion thereof; a mounting table for mounting the target substrate thereon; and a laser irradiation unit for irradiating ring-shaped laser light at once to the whole polymer annularly adhered to the target substrate. The polymer removing apparatus further includes an ozone gas supply unit for supplying an ozone gas to the polymer annularly adhered to the target substrate and a gas exhaust unit for exhausting the ozone gas.
Claims14
A polymer removing apparatus, comprising:
- a processing chamber configured to accommodate a target substrate having polymer adhered to a peripheral portion thereof;
- a mounting table configured to mount the target substrate thereon;
- a laser irradiation unit configured to irradiate ring-shaped laser light at once to the polymer adhered to the peripheral portion of the target substrate;
- an ozone gas supply unit configured to supply an ozone gas to the polymer adhered to the peripheral portion of the target substrate;
- and
- a gas exhaust unit configured to exhaust the ozone gas,
- wherein the laser irradiation unit is provided above the target substrate,
- wherein the apparatus further comprises a reflection member configured to reflect the laser light emitted from the laser irradiation unit toward the polymer adhered to the peripheral portion of the target substrate, and
- wherein the reflection member has a cylindrical shape with a mirror surface at an upper surface thereof, and is positioned outside of the mounting table to surround the mounting table.
A polymer removing method for removing polymer adhered to a peripheral portion of a target substrate, the method comprising:
- providing a polymer removing apparatus comprising:
- a processing chamber configured to accommodate a target substrate having polymer adhered to a peripheral portion thereof;
- a mounting table configured to mount the target substrate thereon;,
- a laser irradiation unit configured to irradiate ring-shaped laser light at once to the polymer adhered to the peripheral portion of the target substrate;
- an ozone gas supply unit configured to supply an ozone gas to the polymer adhered to the peripheral portion of the target substrate;
- and
- a gas exhaust unit configured to exhaust the ozone gas,
- wherein the laser irradiation unit is provided above the target substrate,
- wherein the apparatus further comprises a reflection member configured to reflect the laser light emitted from the laser irradiation unit toward the polymer adhered to the peripheral portion of the target substrate, and
- wherein the reflection member has a cylindrical shape with a mirror surface at an upper surface thereof, and is positioned outside of the mounting table to surround the mounting table;
- the method further comprising:
- mounting the target substrate having the polymer adhered to the peripheral portion thereof on the mounting table;
- irradiating the ring-shaped laser light at once to the polymer adhered to the peripheral portion of the target substrate;
- and
- supplying the ozone gas to the polymer adhered to the peripheral portion of the target substrate while the laser light is irradiated.
Dependencies are inferred from the claim text.