Smooth SiConi etch for silicon-containing films
AssigneeApplied Materials, Inc.
InventorsJing Tang, Nitin Ingle, Dongqing Yang
Life of this patent
Estimating the term…
Loading patent…
AssigneeApplied Materials, Inc.
InventorsJing Tang, Nitin Ingle, Dongqing Yang
Estimating the term…
A method of etching silicon-containing material is described and includes a SiConi™ etch having a greater or lesser flow ratio of hydrogen compared to fluorine than that found in the prior art. Modifying the flow rate ratios in this way has been found to reduce roughness of the post-etch surface and to reduce the difference in etch-rate between densely and sparsely patterned areas. Alternative means of reducing post-etch surface roughness include pulsing the flows of the precursors and/or the plasma power, maintaining a relatively high substrate temperature and performing the SiConi™ in multiple steps. Each of these approaches, either alone or in combination, serve to reduce the roughness of the etched surface by limiting solid residue grain size.
A method of etching a silicon-containing layer on a surface of a substrate in a substrate processing region of a substrate processing chamber, wherein the method leaves a relatively smooth post-etch surface, the method comprising:
A method of etching a silicon-containing layer on a surface of a substrate in a substrate processing region of a substrate processing chamber, wherein the method reduces a difference in etch-rate between a densely patterned area and a sparsely patterned area, the method comprising:
A method of etching a silicon-containing layer on a surface of a substrate in a substrate processing region of a substrate processing chamber, the method comprising:
Dependencies are inferred from the claim text.