Method of forming pattern, method of manufacturing semiconductor device, and method of manufacturing template
AssigneeKabushiki Kaisha Toshiba
InventorTomoko Ojima
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a pattern formation method includes, before forming a circuit pattern on a substrate using imprinting, a wall pattern with a predetermined height is formed to surround the periphery of an area serving as imprint shots on the substrate in each imprint shot and to allow the imprint shots to be separated from one another. The circuit pattern is formed in the imprint shots surrounded by the wall pattern through imprinting.
Claims18
A method of forming a pattern, the method comprising:
- before forming a circuit pattern on a substrate using imprinting, forming a wall pattern with a predetermined height which surrounds a periphery of an area serving as imprint shots on the substrate in each imprint shot and allows the imprint shots to be separated from one another;
- dropping an imprint material in each imprint shot surrounded by the wall pattern;
- and
- firmly pressing a template to the imprint material, thereby allowing the circuit pattern to be formed in the imprint shots surrounded by the wall pattern.
A method of manufacturing a semiconductor device, the method comprising:
- before forming a circuit pattern on a semiconductor substrate using imprinting, forming a wall pattern with a predetermined height which surrounds a periphery of an area serving as imprint shots on the semiconductor substrate in each imprint shot and allows the imprint shots to be separated from one another;
- dropping an imprint material in each imprint shot surrounded by the wall pattern;
- firmly pressing a template to the imprint material, thereby allowing the circuit pattern to be formed in the imprint shots surrounded by the wall pattern;
- and
- producing a semiconductor device using the substrate provided with the circuit pattern.
A method of manufacturing a template, the method comprising:
- before forming a circuit pattern on a first substrate using imprinting, forming a wall pattern with a predetermined height which surrounds a periphery of an area serving as imprint shots on the first substrate in each imprint shot and allows the imprint shots to be separated from one another;
- dropping an imprint material in each imprint shot surrounded by the wall pattern;
- and
- firmly pressing a first template to the imprint material, thereby allowing the circuit pattern to be formed in the imprint shots surrounded by the wall pattern,
- wherein the first substrate provided with the circuit pattern includes a second template which allows the circuit pattern to be transferred onto a second substrate through imprinting.
Dependencies are inferred from the claim text.