Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board

An epoxy resin composition for sheet comprising, as essential components, an epoxy resin (A) having a structure represented by general formula (1), a curing agent (B), an inorganic filler (C) and a cyanate resin and/or a prepolymer of the cyanate resin (D),

• wherein Ar represents a substituted fused aromatic hydrocarbon group;
• r is an integer of or more;
• X represents a hydrogen or an epoxy group (glycidyl ether group);
• R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group;
• n is an integer of 1 or more;
• each of p and q is an integer of 1 or more;
• p's and q's in respective repeating units may be the same as or different from one another, and
• wherein the substituted fused aromatic hydrocarbon group [Ar] in said epoxy resin (A) having the structure represented by general formula (1) is one selected from the group consisting of the structures represented by formulas (Ar1) to (Ar4),
• wherein R2 represents one selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group.

An insulating resin sheet prepared by forming an insulating resin layer made of a resin composition comprising, as essential components, an epoxy resin (A) having a structure represented by general formula (1), a curing agent (B), an inorganic filler (C) and a cyanate resin and/or a prepolymer of the cyanate resin (D), over a carrier film or metal foil,

• wherein Ar represents a substituted fused aromatic hydrocarbon group;
• r is an integer of 1 or more;
• X represents a hydrogen or an epoxy group (glycidyl ether group);
• R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group;
• n is an integer of 1 or more;
• each of p and q is an integer of 1 or more;
• p's and q's in respective repeating units may be the same as or different from one another, and
• wherein the substituted fused aromatic hydrocarbon group [Ar] in said epoxy resin (A) having the structure represented by general formula (1) is one selected from the group consisting of the structures represented by formulas (Ar1) to (Ar4),
• wherein R2 represents one selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group.