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US 8,465,834 B2Granted
Conductive pressure sensitive adhesive tape
AssigneeJoinset Co., Ltd.
InventorSun-Ki Kim
Life of this patent
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Abstract
A conductive pressure sensitive adhesive tape is provided. The conductive pressure sensitive adhesive tape includes a first metal foil, a polymer film attached to a surface of the first metal foil with a polymer binder interposed therebetween, a second metal foil attached to a surface of the polymer film with a polymer binder interposed therebetween, and a polymer adhesive layer formed on a backside of at least one of the first and second metal foils.
Claims10
A conductive pressure sensitive adhesive tape comprising:
- a first metal foil;
- a polymer film attached to a surface of the first metal foil with a polymer binder interposed therebetween;
- a second metal foil attached to a surface of the polymer film with a polymer binder interposed therebetween;
- and
- a polymer adhesive layer formed on a backside of the second metal foil,
- wherein at least one of the first and second metal foils is a rolled metal foil,
- wherein throughholes are formed from the first metal foil and through the polymer film and the second metal foil in a vertical direction of the conductive pressure sensitive adhesive tape, and a conductive adhesive is filled into the throughholes so that the first and second metal foils connect with each other via the throughholes.
4 more elements
Dependencies are inferred from the claim text.