Polymer layer removal on pzt arrays using a plasma etch

A method for forming an ink jet print head, comprising:

• attaching a diaphragm attach material to a diaphragm, wherein the diaphragm comprises a plurality of openings therethrough;
• attaching a plurality of piezoelectric elements to the diaphragm;
• dispensing a dielectric fill material to encapsulate the plurality of piezoelectric elements and to contact the diaphragm, wherein the diaphragm attach material prevents the flow of dielectric fill material through the plurality of openings in the diaphragm;
• curing the dielectric fill material to form an interstitial layer between the plurality of piezoelectric elements and over an upper surface of the plurality of piezoelectric elements;
• placing a patterned adhesive layer and a patterned removable liner over the interstitial layer, wherein openings within the patterned adhesive layer and the patterned removable liner expose the interstitial layer at locations which overlie the piezoelectric elements;
• and
• removing the interstitial layer from the upper surface of the plurality of piezoelectric elements with a plasma etch using the patterned removable liner and the patterned adhesive layer as an etch mask.

A method for forming an ink jet print head, comprising:

• attaching a piezoelectric element layer to a transfer carrier;
• dicing the piezoelectric element layer to form a plurality of piezoelectric elements;
• attaching the plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, wherein the jet stack subassembly further comprises an inlet/outlet plate, a body plate, a plurality of openings in the diaphragm, and a diaphragm attach material which covers the plurality of openings in the diaphragm;
• dispensing a dielectric fill material to encapsulate the plurality of piezoelectric elements and to contact the diaphragm, wherein the diaphragm attach material prevents the flow of dielectric fill material through the plurality of openings in the diaphragm;
• curing the dielectric fill material to form an interstitial layer between the plurality of piezoelectric elements and over an upper surface of the plurality of piezoelectric elements;
• placing a patterned adhesive layer and a patterned removable liner over the interstitial layer, wherein openings within the patterned adhesive layer and the patterned removable liner expose the interstitial layer at locations which overlie the piezoelectric elements;
• removing the interstitial layer from the upper surface of the plurality of piezoelectric elements with a plasma etch using the patterned removable liner and the patterned adhesive layer as an etch mask, wherein the plasma etch comprises introducing an oxygen gas into an etch chamber at a delivery rate sufficient to provide an equilibrium chamber pressure of between about 100 mTorr and about 200 mTorr and igniting a plasma at a radiofrequency power of between about 800 W and about 1,000 W;
• placing a conductive paste within the openings in the patterned removable liner and the patterned adhesive layer;
• removing the patterned removable liner;
• using a laser beam, ablating the diaphragm attach material, the interstitial layer, and the patterned adhesive layer from the plurality of openings in the diaphragm, wherein the body plate and the inlet/outlet plate mask the laser beam;
• mechanically attaching a printed circuit board (PCB) to the interstitial layer with the patterned adhesive layer, wherein the conductive paste electrically coupled PCB electrodes to the piezoelectric elements;
• and
• attaching a manifold to the PCB.