Cooling systems incorporating heat exchangers and thermoelectric layers

A system for cooling an electronic device, comprising:

• a. a fluid heat exchanger;
• b. a pump, coupled with the fluid heat exchanger and configured to pass a fluid therethrough;
• c. a first thermoelectric device having a cooling portion and a heating portion and configured so that at least a portion of the cooling portion is in direct conductive thermal contact with the fluid heat exchanger to cool the fluid heat exchanger;
• d. a heat rejector configured to be in direct conductive thermal contact with at least a portion of the heating portion of the first thermoelectric device;
• and
• e. a second thermoelectric device having a cooling portion and a heating portion and configured so that at least a portion of the heating portion is in direct conductive thermal contact with the fluid heat exchanger to heat the fluid heat exchanger and so that at least a portion of the cooling portion is in contact with a portion of the electronic device to cool the portion of the electronic device.

A system for cooling an electronic device, comprising:

• a. a fluid heat exchanger;
• b. a fluid conduit structure, coupled with the fluid heat exchanger;
• c. a pump, coupled with the fluid conduit structure and configured to pass a fluid therethrough and further through the fluid heat exchanger;
• d. a heat rejector, coupled with the fluid conduit structure and thermally coupled with the fluid contained therein;
• and
• e. a thermoelectric device coupled to the fluid conduit structure such that a first conduit of the fluid conduit structure is coupled between the fluid heat exchanger and the thermoelectric device and a second conduit of the fluid conduit structure is coupled between the thermoelectric device and the heat rejector, wherein the thermoelectric device is thermally coupled with the fluid heat exchanger and thermally coupled with the fluid contained therein.

A microprocessor cooling system, comprising:

• a. a fluid heat exchanger directly and conductively thermally coupled with a microprocessor;
• b. a thermoelectric device directly and conductively thermally coupled with the fluid heat exchanger and thermally coupled with the microprocessor via the fluid heat exchanger;
• c. a heat rejector thermally coupled with both the fluid heat exchanger and with the thermoelectric device;
• d. a pump configured to pass fluid through the fluid heat exchanger;
• and
• e. a heat transmitting path extending from the microprocessor to the fluid heat exchanger before extending towards the thermoelectric device.