US 8,464,780 B2Granted

Heat sink with heat pipes and method for manufacturing the same

AssigneeFurukawa Electric Co., Ltd.

InventorsKenya Kawabata, Masaru Oomi, Ryoji Ohno

Life of this patent

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Abstract

A heat sink to be used with a heat source can include a base portion and a fin portion. The base portion can include a plurality of heat pipes and a space formed at least partially between adjacent heat pipes. The base portion can also include a first plate thermally connected to the heat source and a second plate thermally connected to the fin portion. The plurality of heat pipes contacts the first plate and the second plate. The plurality of heat pipes can also include a first portion that is closer than a second portion to the heat source. Additionally, a distance between adjacent heat pipes is smaller at the first portion than at the second portion.

Claims5

Dependent claims

A heat sink for dissipating heat from a heat source, comprising:

a base portion having inside thereof at least one heat pipe, a space formed around part of a peripheral portion of said heat pipe, and a metal block;
and
a fin portion externally and thermally connected to said base portion;
wherein said base portion comprises a first plate member thermally connected to the heat source, and a second plate member thermally connected to said fin portion;
and
said at least one heat pipe and said metal block are placed between said first plate member and said second plate member, and are thermally connected to said first plate member and said second plate member;
wherein said metal block is arranged only in a. portion of said first plate member which is connected to said heat source.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/907,591Filed 19 Oct 2010 · continuation
Priority: 12 Sep 2003
Published: US 2011/0030924 A110 Feb 2011
Granted: 18 Jun 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

F28D 15/0233
In which the medium condenses and evaporates, e.g. heat pipes: the conduits having a particular shape, e.g. non-circular cross-section, annular
F28D 15/0275
In which the medium condenses and evaporates, e.g. heat pipes: arrangements for coupling heat-pipes together or with other structures, e.g. with…
F28F 3/02
Plate-like or laminated elements; Assemblies of plate-like or laminated elements: elements or assemblies thereof with means for increasing…
F28D
Heat-exchange apparatus, not provided for in another subclass, in which the heat-exchange

Family

Application60/502,821Us provisional application · filed 12 Sep 2003
Application10/936,850Parent of this continuation · filed 9 Sep 2004
US 2011/0030924 A1Pre-grant publication · published 10 Feb 2011
US 2005/0098300 A1Published application
US 8,464,780 B2This patent

From the US filing history. Foreign family members aren’t listed.

Timeline

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