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AssigneeJX Nippon Mining & Metals Corporation
InventorsYousuke Kobayashi, Atsushi Miki, Keisuke Yamanishi
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Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and also suits for use in producing a flexible printed wiring board capable of bearing a fine wiring pattern. Additionally provided is a method of roughening the rolled copper or copper alloy foil.
A copper or copper alloy foil consisting of a rolled copper or copper alloy foil having a roughened surface consisting of fine copper particles in which craters exist in an amount of 1.3 craters/mm2 or less, the roughened surface being obtained by subjecting the rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2.
A copper alloy foil consisting of a rolled copper alloy foil containing at least one or more elements selected among Ag, Sn, Cr, Zr, Zn, Ni, Si, Mg, and Ti in a total amount of 0.03 to 5 wt % and remnant Cu and unavoidable impurities and having a roughened surface consisting of fine copper particles, said roughened surface having craters in which a number of craters is 1.3 craters/mm2 or less, said roughened surface being produced by a process comprising the steps of subjecting a rolled copper alloy foil to roughening plating with a plating bath consisting of copper sulfate having a Cu equivalent of 1 to 50 g/L, 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2.
A copper alloy foil consisting of a rolled copper alloy foil containing at least one or more elements selected among Ag, Sn, Cr, Zr, Zn, Ni, Si, Mg, and Ti in a total amount of 0.03 to 5 wt % and remnant Cu and unavoidable impurities and having a roughened surface of fine copper particles, said roughened surface having craters in which a number of craters is 0.5 craters/mm2 or less, said roughened surface being produced by a process comprising the steps of subjecting a rolled copper alloy foil to roughening plating with a plating bath consisting of copper sulfate having a Cu equivalent of 1 to 50 g/L, nickel sulfate having a Ni equivalent of 1 to 50 g/L, 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2.
Dependencies are inferred from the claim text.