Integrated circuit of decreased size
AssigneeSTMicroelectronics (Rousset) SAS
InventorsStephan Niel, Jean-Michel Mirabel
Life of this patent
Estimating the term…
Abstract
An integrated circuit including an insulating layer having first and second opposite surfaces. The circuit includes, in a first area, first conductive portions of a first conductive material, located in the insulating layer, flush with the first surface and continued by first vias of the first conductive material, of smaller cross-section and connecting the first conductive portions to the second surface. The circuit further includes, in a second area, second conductive portions of a second material different from the first conductive material and arranged on the first surface and second vias of the first conductive material, in contact with the second conductive portions and extending from the first surface to the second surface.
Claims8
An integrated circuit comprising an insulating layer having first and second opposite surfaces, comprising:
- in a first area, first conductive portions of a first tungsten-based conductive material, located in the insulating layer, flush with the first surface and continued by first vias of the first conductive material of smaller cross-section and extending to the second surface;
- and
- in a second area, second conductive portions of a second aluminum-based conductive material arranged on the first surface and second vias of the first tungsten-based conductive material, in contact with the second conductive portions and extending from the first surface to the second surface.
A method for manufacturing an integrated circuit comprising the steps of:
- providing an insulating layer having first and second opposite surfaces;
- forming, in a first area of the integrated circuit, first conductive portions of a first tungsten-based conductive material, located in the insulating layer, flush with the first surface and continued by first vias of the first conductive material of smaller cross-section and extending to the second surface;
- and
- forming, in a second area of the integrated circuit, second conductive portions of a second aluminum-based conductive material arranged on the first surface and second vias of the first tungsten-based conductive material, in contact with the second conductive portions and extending from the first to the second surface.
Dependencies are inferred from the claim text.