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US 8,415,787 B2Granted
Integrated circuits having interconnects and heat dissipators based on nanostructures
AssigneeSmoltek AB
InventorMohammad Shafiqul Kabir
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Abstract
The present invention relates to a heat dissipator that includes a conductive substrate and a plurality of nanostructures supported by the conductive substrate. The nanostructures are at least partly embedded in an insulator. Each of the nanostructures includes a plurality of intermediate layers on the conductive substrate. At least two of the plurality of intermediate layers are interdiffused, and material of the at least two of the plurality of intermediate layers that are interdiffused is present in the nanostructure.
Claims7
A heat dissipator, comprising:
- a conductive substrate;
- and
- a plurality of nanostructures supported by said conductive substrate, said plurality of nanostructures being at least partly embedded in an insulator,
- wherein each of said nanostructures comprises:
- a plurality of intermediate layers on the conductive substrate, wherein at least two of the plurality of intermediate layers are interdiffused, and wherein material of the at least two of the plurality of intermediate layers that are interdiffused is present in the nanostructure.
2 more elements
Dependencies are inferred from the claim text.