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US 8,411,460 B2Granted
Printed circuit board
AssigneesHONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., Hon Hai Precision Industry Co., Ltd.
InventorsGuang-Feng Ou, Yong-Zhao Huang
Life of this patent
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Abstract
A printed circuit board includes a power layer, a ground layer, a signal layer, and a backboard. The backboard is arranged below the signal layer opposite to the ground layer. A number of vias are formed from the backboard through the signal layer, and then connected to the ground layer.
Claims1
A printed circuit board (PCB) comprising:
- a ground layer;
- a first signal layer;
- and
- a backboard;
- wherein the backboard is arranged below the first signal layer, a plurality of vias is formed on the backboard and equidistantly arranged along peripheral edges of the backboard, the plurality of vias extend through the first signal layer and are connected to the ground layer for anti-EMI, and
- further comprising a second signal layer and a power layer, wherein the power layer is sandwiched between the second signal layer and the ground layer, the first signal layer is arranged below the ground layer opposite to the power layer, the backboard is arranged below the first signal layer opposite to the ground layer;
- wherein a distance S of each two vias of the plurality of vias is described as:
- S<C/(20*f*Er1/2), where “C” stands for the speed of light, “Er” stands for the dielectric constant of dielectric formed between signal layer and power/ground layer, “f′ stands for the highest frequency of radiated wave.
5 more elements
Dependencies are inferred from the claim text.