Cooled universal hardware platform

A cooled universal hardware platform, comprising:

• a frame including a module insertion area on a first side of a rack;
• a power bus to provide power;
• a plurality of cooled partitions coupled within the frame;
• a plurality of module bays defined by a volume of space between each consecutive cooled partition of the plurality of cooled partitions, wherein each of the plurality of module bays have a pitch (P) equal to a distance between a first surface of one cooled partition and a second surface of an adjacent cooled partition;
• two or more service units, wherein each of the two or more service units is comprised of at least one component module inserted into at least one of the plurality of module bays, wherein each component module comprises:
• a first thermal plate substantially parallel to a second thermal plate, wherein each thermal plate includes an inner surface facing each other and an outer surface opposite to the inner surface;
• each thermal plate configured to physically and thermally couple one or more component units to its inner surface;
• and
• one or more tensioning units coupled to and located between the first and the second thermal plates, the one or more tensioning units configured to provide a contact bias between the outer surface of each thermal plate and each surface of the cooled partitions defining a module bay when the component module is inserted into the module bay;
• and
• a coolant source coupled to the plurality of cooled partitions, wherein each cooled partition includes at least one channel between a first surface and a second surface of each cooled partition to permit coolant flow within the cooled partitions and to provide cooling to each module of the two or more service units.