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US 8,410,602 B2Granted
Cooling system for semiconductor devices
AssigneeIntel Corporation
InventorsVenkat Natarajan, Arun Chandrasekhar, Pr Patel, Vittal Kini
Life of this patent
Estimating the term…
Abstract
In one embodiment, the present invention includes a socket for a semiconductor package, where the socket has a frame with a segmented design, where socket streets are located between the segments. One or more of the streets may include a conduit to enable thermal transfer during operation of the semiconductor package. Other embodiments are described and claimed.
Claims17
An apparatus comprising:
- a segmented socket to receive a single semiconductor package, the socket to a couple to a circuit board and having a frame including a plurality of segments with gaps therebetween and mounted in the frame, each of the plurality of segments with including terminals to be coupled to corresponding contacts of the semiconductor package, the frame including a plurality of streets located between the segments, the terminals localized within the plurality of segments and not within the plurality of streets, at least one of the streets including a conduit within the at least one street and routed therethrough to enable thermal transfer during operation of the semiconductor package, wherein the conduit is to be coupled to a thermal solution outside of the socket, and a metal plate adapted within an interior of the socket and surrounded by the plurality of segments, wherein the metal plate includes at least one embedded conduit coupled to the conduit within one of the streets, which in turn is coupled to a heat sink coupled to an integrated heat spreader of the semiconductor package.
A system comprising:
- a circuit board having a primary side and a secondary side, the primary side including a segmented socket coupled thereto, the socket to receive a single semiconductor package and having a frame including a plurality of segments with gaps therebetween and mounted in the frame, each of the plurality of segments including terminals to be coupled to corresponding contacts of the semiconductor package, the frame including a plurality of streets, each located between a pair of the segments, the terminals localized within the plurality of segments and not within the plurality of streets, at least one of the streets including a conduit within the at least one street and routed therethrough to enable thermal transfer during operation of the semiconductor package and a metal plate adapted within an interior of the socket and bellow the semiconductor package to adapt to a second semiconductor device of the semiconductor package, the metal plate surrounded by the plurality of segments, wherein the metal plate includes at least one embedded conduit to communicate with the conduit within the at least one street;
- the semiconductor package having a package substrate, a first semiconductor device coupled to a topside of the package substrate and a second semiconductor device coupled to a backside of the package substrate, wherein the first semiconductor device and the second semiconductor device are coupled together by a plurality of through silicon vias within the package substrate;
- and
- a heat pipe coupled to the conduit, the heat pipe extending from the socket to the thermal solution.
1 more element
A system comprising:
- a segmented socket to receive a single semiconductor package and having a frame including a plurality of segment with gaps there between and mounted in the frame, and each of the plurality of segments including terminal to be coupled to corresponding contacts of the semiconductor package, the frame including a plurality of streets, each located between a pair of the segments, at least one of the streets including a conduit within the at least one street and routed therethrough and a metal plated adapted within an interior of the socket and surrounded by the plurality of segments, wherein the metal plate includes at least one embedded conduit coupled to the conduit within one of the streets;
- and
- the semiconductor package having a package substrate, a processor coupled to a first side of the package substrate and at least one memory coupled to a second side of the package substrate, wherein the processor is to be cooled by a heat sink coupled to a topside of the semiconductor package via an integrated heat spreader and the at least one memory is to be cooled by the conduit rooted underside of the semiconductor package that is in communication with the heat sink.
The system of 15, wherein the metal plate includes at least one embedded conduit to communicate with the conduit within the at least one street of the socket.
Dependencies are inferred from the claim text.