Optocoupler devices
AssigneeFairchild Semiconductor Corporation
InventorYong Liu
Life of this patent
Estimating the term…
Abstract
Optocoupler devices and methods for making and using such devices are described. The optocoupler devices contain a light emitting component (a light emitting diode [LED]) and a light receiving component (a phototransistor [PT]) device that are embedded within the substrate, rather than being attached to the surface of the pre-molded substrate. Such a configuration eliminates the bond wires that are often used when the LED and PT are attached on the substrate, improves the electrical performance, and allows the final optocoupler package to be made smaller and thinner. Other embodiments are described.
Claims20
An optocoupler package, comprising:
- a light emitting component;
- a light receiving component;
- a substrate enclosing the light emitting component and the light receiving component except for an upper surface and a portion of a side surface thereof;
- solder balls located on an upper surface of the substrate;
- terminals located on a bottom surface of the substrate;
- an upper metal trace structure connecting the light emitting and light receiving components with the solder balls;
- and
- a lower metal trace structure connecting the light emitting and light receiving components with the terminals.
An electronic device containing an optocoupler package, the package comprising:
- a light emitting component;
- a light receiving component;
- a substrate enclosing the light emitting component and the light receiving component except for an upper surface and a portion of a side surface thereof;
- solder balls located on an upper surface of the substrate;
- terminals located on a bottom surface of the substrate;
- an upper metal trace structure connecting the light emitting and light receiving components with the solder balls;
- and
- a lower metal trace structure connecting the light emitting and light receiving components with the terminals.
An optocoupler device, comprising:
- a light emitting diode contained in a first die;
- a phototransistor contained in a second die;
- a substrate comprising a resin material and enclosing the light emitting diode and the phototransistor except for an upper surface and a portion of a side surface thereof;
- solder balls located on an upper surface of the substrate;
- terminals located on a bottom surface of the substrate;
- an upper metal trace structure connecting the light emitting diode and phototransistor with the solder balls;
- and
- a lower metal trace structure connecting the light emitting diode and phototransistor with the terminals.
Dependencies are inferred from the claim text.