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US 8,409,770 B2Granted
Blank mask and method of fabricating mask using the same
AssigneeSK hynix Inc.
InventorSoo Kyeong Jeong
Life of this patent
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Abstract
A blank mask includes a substrate, a multilayer reflection layer disposed over the substrate, a capping layer disposed over the multilayer reflection layer, a self-assembled monolayer disposed over the capping layer, a buffer layer disposed over the self-assembled monolayer, and an absorption layer disposed over the buffer layer.
Claims12
A blank mask comprising:
- a substrate;
- a multilayer reflection layer disposed over the substrate;
- a capping layer disposed over the multilayer reflection layer;
- a self-assembled monolayer disposed over the capping layer;
- a buffer layer disposed over the self-assembled monolayer;
- and
- an absorption layer disposed over the buffer layer.
4 more elements
A blank mask comprising:
- a substrate;
- a multilayer reflection layer disposed over the substrate;
- a capping layer disposed over the multilayer reflection layer;
- a buffer layer disposed over the capping layer and composed of a self-assembled monolayer;
- and
- an absorption layer disposed over the self-assembled monolayer.
3 more elements
A method of fabricating a mask, the method comprising:
- preparing a blank mask comprising a substrate, a multilayer reflection layer disposed over the substrate, a capping layer disposed over the multilayer reflection layer, a self-assembled monolayer disposed over the capping layer, a buffer layer disposed over the self-assembled monolayer, and an absorption layer disposed over the buffer layer;
- forming an absorption pattern and a buffer pattern by etching the absorption layer and the buffer layer using the self-assembled monolayer as an etching stop layer;
- and
- removing the self-assembled monolayer exposed by the absorption pattern and the buffer pattern.
1 more element
A method of fabricating a mask, the method comprising:
- preparing a blank mask comprising a substrate, a multilayer reflection layer disposed over the substrate, a capping layer disposed over the multilayer reflection layer, a buffer layer disposed over the capping layer and composed of a self-assembled monolayer, and an absorption layer disposed over the self-assembled monolayer;
- partially exposing a surface of the buffer layer by etching a portion of the absorption layer;
- and
- removing an exposed portion of the buffer layer by irradiating ultraviolet light onto the exposed portion of the buffer layer.
1 more element
Dependencies are inferred from the claim text.