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US 8,409,467 B2Granted
Polishing liquid for semiconductor integrated circuit
AssigneeFUJIFILM Corporation
InventorsToshiyuki Saie, Tetsuya Kamimura
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Abstract
A polishing liquid for polishing a barrier layer of a semiconductor integrated circuit, which liquid includes: a quaternary ammonium cation; a corrosion inhibiting agent; a polymer compound having a sulfo group at a terminal; inorganic particles; and an organic acid, the pH of the polishing liquid being in the range of 1 to 7.
Claims10
A polishing liquid for polishing a barrier layer of a semiconductor integrated circuit, the polishing liquid comprising:
- a quaternary ammonium cation;
- a corrosion inhibiting agent;
- a polymer compound containing a benzene ring and having a sulfo group at a terminal;
- inorganic particles;
- and
- an organic acid;
- wherein
- the pH of the polishing liquid is in the range of 1 to 7.
5 more elements
Dependencies are inferred from the claim text.