Device for coating the outer edge of a substrate during microelectronics manufacturing
AssigneeBrewer Science Inc.
InventorsGary J. Brand, Philip H. Allen, Ramachandran K. Trichur
Life of this patent
Estimating the term…
Loading patent…
AssigneeBrewer Science Inc.
InventorsGary J. Brand, Philip H. Allen, Ramachandran K. Trichur
Estimating the term…
New baffles and methods of using these baffles are provided. The baffles comprise a body having an edge wall configured to direct the flow of a composition against a substrate (e.g., silicon wafer) edge. The edge wall comprises a vertical surface, a curved sidewall coupled to the vertical surface, and a lip coupled to the curved sidewall. A preferred baffle is annular in shape and formed from a synthetic resinous composition. Even more preferably, the baffle is not formed of a metal. The inventive methods comprise positioning the baffle adjacent a substrate during a spin coating process so that the edge wall causes the composition to cover the edges of the substrate and preferably a portion of the back side of the substrate.
In a baffle for affecting the flow of a composition during application of the composition to a substrate having a maximum cross-sectional substrate dimension and an edge, the improvement comprising:
In a baffle for affecting the flow of a composition during application of the composition to a substrate having a maximum cross-sectional substrate dimension and an edge, the improvement comprising:
In a baffle for affecting the flow of a composition during application of the composition to a substrate having a maximum cross-sectional substrate dimension and an edge, the improvement comprising:
The combination of:
Dependencies are inferred from the claim text.