Transfer film, method of manufacturing the same, transfer method and object surface structure
AssigneeCompal Electronics, Inc.
InventorsJu-Chen Chiu, Yin Ta Chen
Life of this patent
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AssigneeCompal Electronics, Inc.
InventorsJu-Chen Chiu, Yin Ta Chen
Estimating the term…
A transfer film including a protection layer and a substrate is provided. The substrate has a first surface with a first three-dimensional pattern and a second surface. The first three-dimensional pattern has at least one protrusion portion or at least one recess portion. The protection layer is disposed on the substrate and has a third surface and a fourth surface. The third surface contacts the first surface and has a second three-dimensional pattern complementary to the first three-dimensional pattern. The second three-dimensional pattern of the third surface is formed by covering the first three-dimensional pattern of the first surface. The protection layer and the substrate are separated after transfer, so as to expose the second three-dimensional pattern.
A transfer film, comprising:
Dependencies are inferred from the claim text.