US 8,319,114 B2 · Surface mount power module dual footprint

Abstract

A dual footprint mounting package for a surface mount power converter modules and its method of manufacture. Castellated regions are formed on the edge of the component package using the appropriate sized drill or milling bit. Edge plating is applied to the castellated surfaces to create edge pads. The edge plating provides electrical continuity between the edge pads and the SMT pads. Solder mask, or other materials, is applied to prevent solder from wicking between each SMT pad and its respective edge pad. Such component may be attached to a larger device PWB using either the edge pads or the SMT pads, or may even be attached using a combination of the two, such as in the event of a pad failure or other defect.

Claims12

Dependent claims

A dual footprint mounting package for a surface mount technology (SMT) electrical component, the package comprising:

in a SMT power converter module device, at least one edge pad in electrical continuity with a SMT pad, wherein the SMT pad forms an electrical connection to the SMT power converter module device when soldered to a corresponding pad on a PWB, and the edge pad provides an alternate point for forming an electrical connection between the SMT power converter module device and the PWB when soldered to a surface pad on the PWB;
and
at least one isolated edge pad not in electrical continuity with the SMT pad, wherein the isolated edge pad forms a mechanical connection to the PWB when soldered to a pad on the PWB.

Dependencies are inferred from the claim text.

Surface mount power module dual footprint

Life of this patent

Surface mount power module dual footprint

Life of this patent

Abstract

Claims12